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International Engineering Consortium's Euro DesignCon 2004 to Feature Vast Array of Technical Papers
Committee of Distinguished Design Engineers Selects Papers for
Presentation at Event That Will Include Highly-Focused Educational
Tracks
CHICAGO—(BUSINESS WIRE)—Aug. 24, 2004—
The International Engineering Consortium (IEC) has announced that
the Technical Program Committee of its newest event, Euro DesignCon
2004, has selected 40 papers for presentation from the more than 120
that were submitted by practicing engineers in the semiconductor and
electronic-design industries.
Each paper offers in-depth perspectives that will be presented
during a 45-minute session that falls within one of the following
technical tracks: Design Verification, Silicon System Design,
Chip-Level Physical Design, Test and Debug, High-Speed Interconnect
Systems, Automotive System Design, and Wireless Communication System
Design.
"A hallmark of DesignCon events is that we delve deeply into the
most critical challenges facing semiconductor and electronic-design
engineers and develop a very in-depth learning forum that will yield
solutions that can be implemented immediately in their designs,"
explained John Janowiak, Senior Director of the IEC.
Janowiak cited the event's Technical Forums as another example of
Euro DesignCon 2004's highly focused learning environment, where an
array of subjects will be examined including "Advances in Platform
ASICs," "M-LVDS in Practice: New Life for Multipoint Buses," "Applying
Physics-Based Analysis to the Design and Verification," and "Signal
Integrity Analysis for Clock and DataCom Applications."
Based on the IEC's highly successful DesignCon program in the
United States, Euro DesignCon 2004's presentations will address
current issues that are of most significance to the European
semiconductor and electronic-design communities. In addition to the
technical paper presentations and Technical Forums, the event will
offer a comprehensive educational program of keynote addresses,
plenary and technical panels, and a hands-on technology exhibition
featuring more than 30 industry-leading companies.
Euro DesignCon 2004 will take place 11-14 October 2004 at the
ArabellaSheraton Grand Hotel in Munich, Germany. Registration and
program information for Euro DesignCon 2004 can be found at
http://www.designcon.com/euro.
About DesignCon Events (www.designcon.com) DesignCon, DesignCon
East, and Euro DesignCon conference programs provide education and
updates on the latest technology advances affecting engineers working
at the chip, board, and system levels. DesignCon technology
exhibitions deliver practical approaches, techniques, and procedures
directly on the show floor, where leading-edge displays from key
organizations offer proven solutions for immediate application.
About the IEC (www.iec.org) The International Engineering
Consortium (IEC) is a nonprofit organization dedicated to catalyzing
technology and business progress worldwide in a range of
high-technology industries and their university communities. Since
1944, the IEC has provided high-quality educational opportunities for
industry professionals, academics, and students. In conjunction with
industry-leading companies, the IEC has developed an extensive free
on-line educational program. The IEC conducts industry-university
programs that have substantial impact on curricula. It also conducts
research and develops publications, conferences, and technological
exhibits that address major opportunities and challenges of the
information age. More than 70 leading high-technology universities are
IEC affiliates, and the IEC handles the affairs of the Electrical and
Computer Engineering Department Heads Association.
Contact:
The International Engineering Consortium (IEC)
Lynne Bobak, 312-559-3862
lbobak@iec.org
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